Researchers leverage 3D printing for microelectronic cooling
The work from the University of Twente paves the way for more powerful devices that use less energy
According to the University of Twente, a research team has developed a breakthrough 3D printing solution to tackle the challenge of overheating in chips, earning them the prestigious Thematic Technology Transfer Proof of Concept (TTT-PoC) Award. The technology enables far more efficient cooling in advanced microelectronics, paving the way for more powerful devices that use less energy.
The ongoing miniaturization of semiconductors enables the integration of more functionality into smaller components. However, this also increases heat generation, threatening the reliability and lifespan of microelectronics. Improving energy efficiency alone is not enough; advanced thermal management has become essential to enable the next generation of innovation.
The TTT-PoC program recognized this challenge by awarding the team’s breakthrough in additive manufacturing for advanced microelectronic cooling. This approach addresses thermal management, the critical bottleneck in delivering more power in smaller packages while minimising the energy required for cooling.
The research team, led by Dr. S. Dehgahi and supported by Dr. Jafari and Federico van Eijnatten, brings deep expertise in powder metallurgy, computational thermodynamics, and AM.
“We must tackle fundamental and technical challenges in metallurgy, additive manufacturing, and advanced materials characterisation. This is the ideal moment to advance and commercialise our technology, positioning it for integration into future advanced packaging platforms,” said Dr. Shirin Dehgahi.
The team will validate the technology across the entire value chain, working closely with designers and manufacturers at the die, package, and system levels. This chain-wide approach will help identify the most impactful applications and maximize benefits for the microelectronics industry.
