AM SoftwareFormnext

Raise3D launches Open Software Program (OSP)

Following the same philosophy as the company's Open Filament Program (OFP), which enabled the collaboration of 42 filament manufacturers over a five year period

Stay up to date with everything that is happening in the wonderful world of AM via our LinkedIn community.

Raise3D, a global provider of additive manufacturing solutions for SMEs and LSEs, and inventor of Hyper FFF, has launched the company’s Open Software Program (OSP), a program aimed at facilitating the cooperation of software companies within the Raise3D ecosystem.

In November 2017, Raise3D launched its Open Filament Program (OFP), a program that, in only five years, enabled the collaboration of 42 of some of the most relevant filament manufacturers in the market, and led to the approval and release of 172 filaments that notably increased the availability of top performing filaments, and the overall printing experience, for Raise3D’s customers. The OFP continues to be a strategic pilar for Raise3D, with dozens of new filaments to be released in the near future.

Raise3D launches Open Software Program (OSP). Following the same philosophy as the company's Open Filament Program (OFP).
ideaMaker

With the launch of OSP, Raise3D is taking another step towards improving their customers’ experience.

“Raise3D offers their customers a complete ecosystem for 3D printing, which currently includes eight different options of 3D printers, a wide range of filaments, a slicing software (ideaMaker), and a print management software with different installation options (RaiseCloud). Raise3D ecosystem provides everything a customer may need to efficiently implement its 3D printing production. Many customers, however, have embedded in their product development process, or in their production process, other software solutions that focus on their specific industry. These customers will benefit if the software they use is connected with Raise3D’s ecosystem, and the subsequent improvement in their experience justifies the launch of the OSP,” explained Tank He, Director of Software at Raise3D.

Raise3D launches Open Software Program (OSP). Following the same philosophy as the company's Open Filament Program (OFP).
ideaMaker

Just like the OFP concept, in the OSP Raise3D welcomes the developers of the best software solutions to cooperate with Raise3D to improve its customer’s experience. There are currently four software companies collaborating on the OSP, during the pre-launch period. Raise3D now welcomes all other relevant software companies to contact the OSP Manager for more information and to discuss collaboration.

Research
Composites AM 2024

746 composites AM companies individually surveyed and studied. Core composites AM market generated over $785 million in 2023. Market expected to grow to $7.8 billion by 2033 at 25.8% CAGR. This new...

Edward Wakefield

Edward is a freelance writer and additive manufacturing enthusiast looking to make AM more accessible and understandable.

Related Articles

Leave a Reply

Your email address will not be published. Required fields are marked *

Back to top button
Close Popup
Privacy Settings saved!
Privacy Settings

When you visit any web site, it may store or retrieve information on your browser, mostly in the form of cookies. Control your personal Cookie Services here.

These cookies are necessary for the website to function and cannot be switched off in our systems.

Technical Cookies
In order to use this website we use the following technically required cookies
  • PHPSESSID
  • wordpress_test_cookie
  • wordpress_logged_in_
  • wordpress_sec

Decline all Services
Save
Accept all Services

Newsletter

Join our 12,000+ Professional community and get weekly AM industry insights straight to your inbox. Our editor-curated newsletter equips executives, engineers, and end-users with crucial updates, helping you stay ahead.