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NXG printer users to have greater process control with new Materialise BPs

Partnership between Materialise and Nikon SLM Solutions

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Nikon SLM Solutions and Materialise are preparing to launch the next generation of Materialise build processors (BPs) for Nikon SLM Solutions NXG systems. The updated BPs will not only accelerate data processing and give users more control over process parameters, but also facilitate integration with the Materialise CO-AM platform, a cloud-based software that enables the scaling of AM workflows. The partnership has the overall aim of giving metal AM users what they need to customize their 3D printing processes and achieve superior part quality, competitive pricing and reliable, high throughput production.

The next-generation of Materialise build processors for Nikon SLM Solutions’ NXG 3D printers are expected to be released in the coming months, and all NXG users can benefit from the upgrade. The new software was developed to address certain bottlenecks associated with the powerful NXG machines, which are powered by 12 1kW lasers and offer among the industry’s largest build capacities for metal AM. Specifically, the 3D printers must process a ton of data, which can translate to long calculation times. The new BPs not only link the hardware with data preparation software programs, but give users greater control over the 3D printing process through customizable process parameters.

“Working with Materialise, we have made a giant leap in developing a high-performative build processor. With this next generation of build processors, our customers using Materialise software will save time during the print job setup and profit from tools to optimize their print process,” said Nicolas Lemaire, Product Manager of Software, Product Control and Strategic Partnerships at Nikon SLM Solutions.

Materialise Build Processor Nikon SLM NXG

By giving users the ability to optimize printing and machine parameters through either the Nikon SLM Open Architecture or the Materialise BP Software Development Kit (SDK) (which has the benefit of letting users create and encapsulate their own IP), the new BPs will unlock faster calculation times, and the ability to achieve greater cost efficiency, production speeds, part quality and repeatability, as well as reduced scrap rates and lead times.

“Nikon SLM Solutions and Materialise share a vision of open systems that enable AM users to make optimal use of their equipment and connect it to their preferred solutions,” added Bart Van der Schueren, CTO of Materialise. “We look forward to offering the next generation of BPs to Nikon SLM Solutions users and providing them access to software solutions covering the whole AM workflow.”

Alongside the new Materialise BPs, Nikon SLM Solutions 3D printers will also be able to connect their machines directly to the Materialise CO-AM platform vis SLM.Link. The CO-AM platform makes it easier to integrate metal AM systems into existing production workflows as well as opens access to a host of other solutions, like CO-AM partner solutions for design automation, mass customization, automated labeling, post-processing technologies, and more.

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Tess Boissonneault

Tess Boissonneault is a Montreal-based content writer and editor with five years of experience covering the additive manufacturing world. She has a particular interest in amplifying the voices of women working within the industry and is an avid follower of the ever-evolving AM sector. Tess holds a master's degree in Media Studies from the University of Amsterdam.

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