NIDEC Machine Tool America rebrands AM division and consolidates three tech platforms
Newly named Advanced Manufacturing Technologies groups metal 3D printing, laser micromachining, and wafer bonding under a single division
NIDEC Machine Tool America has rebranded its Additive Manufacturing division as Advanced Manufacturing Technologies, consolidating three distinct precision manufacturing platforms under a single organizational unit.
The restructured division brings together LAMDA, the company’s Laser Powder DED Additive Manufacturing system; ABLASER, a laser micromachining system; and BOND MEISTER, a room-temperature wafer bonding machine targeting semiconductor and microelectromechanical systems (MEMS) applications.
“This expansion reflects where the industry is heading and where we stand as a company,” stated Tyson Gregory, Advanced Manufacturing Technologies Sales Manager at NIDEC Machine Tool America. “By bringing these specialized systems together, we are making it easier for our North American customers to leverage our full suite of solutions.”
The LAMDA series is built for large-scale metal 3D printing and incorporates AI anomaly detection for real-time process monitoring. A local shield nozzle enables printing of reactive materials without a full inert gas enclosure, reducing setup complexity.
The ABLASER uses proprietary optical head technology and a prism rotator to perform helical micromachining, drilling holes as small as 27 µm in diameter in silicon, silicon carbide (SiC), and ceramics without thermal distortion.
And BOND MEISTER performs room-temperature surface activation bonding in a high-vacuum environment, eliminating thermal stress and enabling the joining of dissimilar semiconductor materials including gallium nitride (GaN), gallium arsenide (GaAs), and silicon.
All three systems are already available through NIDEC Machine Tool America’s North American sales and service network.
