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ioTech shapes a flexible future for 3D printed electronics

New design opportunities are opening up via the patented Continuous Laser Assisted Deposition, CLAD, technology

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Fast-growing Israeli-based venture ioTech is showcasing at LOPEC 2024 (March 6 and 7 in Munich, Germany), the International Exhibition and Conference for Flexible, Organic and Printed Electronics, how its disruptive digital manufacturing Continuous Laser Assisted Deposition, or CLAD, technology can shape the future of micro-electronics and additive manufacturing.

Hervé Javice, ioTech’s co-founder and CEO commented: “We are delighted to be exhibiting at LOPEC for the first time and be able to demonstrate how customers can increase production efficiencies, embrace a more agile manufacturing approach, and deliver “until-now-impossible-to-manufacture” designs, all in a sustainable manner. The possibilities of our technology are endless. ioTech’s CLAD technology has been validated by key players in the market and is attracting orders from industry leaders in microprocessors, µLED, defense, e-Mobility power devices and batteries.”

ioTech shapes a the flexible future of 3D printed electronics with Continuous Laser Assisted Deposition, CLAD, technology
ioTech’s CLAD system can print and combine multiple (flowable) materials at high resolution and at high speed, offering the flexibility of dispensing at the speed of screen printing.

ioTech’s Continuous Laser Assisted Deposition (CLAD) technology revolutionizes material deposition with several key advantages over existing methods, paving the way for seamless full-scale digital mass manufacturing. Unlike traditional techniques, CLAD is material-agnostic, seamlessly integrating a variety of industrial materials without the need for reformulation or additives, thus meeting stringent OEM qualification requirements effortlessly. This versatile digital approach enables the mass customization of intricate geometrical shapes and rapid prototyping without the constraints of masks or screens, thanks to its high-speed deposition capabilities accommodating multiple materials and layers.

CLAD’s compatibility with diverse substrate materials, including non-planar surfaces, and its agility in handling high-viscosity materials without clogging, set it apart from conventional methods like Laser Direct Structuring and inkjet systems. Its efficiency matches the demanding productivity standards of semiconductor packaging and assembly plants, offering alternative solutions for creating conductive geometries with reduced electrical resistance and footprint. Moreover, CLAD demonstrates sustainability by replacing subtractive technologies, contributing to Environmental, Social, and Governance (ESG) initiatives and reshoring efforts.

At the show, ioTech will expand on the great potential for digital mass-manufacturing applications in the micro-electronic market. It will share how manufacturers can use their standard certified industrial materials, control the deposition of each single drop, and reach unmatched production yields with the ioTech io300 digital printer. Its speed and resolution – the fastest and highest on the market today – drive the delivery of commercial solutions across multiple verticals and open the potential for major miniaturization in semiconductor packaging and advanced printed circuit board production and assembly.

Founded in 2016, ioTech has offices in the UK and Israel. ioTech’s system can print and combine multiple (flowable) materials at high resolution and at high speed, offering the flexibility of dispensing at the speed of screen printing. With over 50 patents, most of them granted, the company is a pioneer in additive manufacturing innovation.



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  1. I will predict that outside of these companies, perhaps GE with combined Arcam and Concept Laser or UnionTech, or even BambuLabs will show up on this list perhaps next year or two, but I’m really just mentioning companies that should have a relatively strong growth potential. We have a severe contraction coming in this market segment for the next 2-3 years, as this industry tries to ‘finds itself.’ This is an acquire, merge or die trying landscape at the moment, and under the surface is some utter panic in many of the OEMs that are not owned by a larger parent company, stayed lean enough, owned IP or had a successful enough product, try to stay self sustainable. The industrial AM landscape will have to look much different in a couple years time to make more meaningful strides into mainstreams of manufacturing that it promised and so wonderfully hyped years ago, yet failed to fully deliver on. Let’s hope that the next top 10 has some healthier competition in the coming years as the total market probably needs a 35-40% reduction in players, with more focused solutions, then we can see how these companies can live up to expectations for clients and investors alike.

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