AM SoftwareProcess Monitoring

Interspectral launches integration for EOSCONNECT in AM Explorer

New module offers EOS customers one-click direct access to process monitoring data

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Interspectral launched a deep integration with EOSCONNECT Core module in AM Explorer. This new module offers EOS customers one-click direct access to the comprehensive process monitoring data available from EOS machines within AM Explorer. The integration represents a significant leap forward in the process monitoring and quality assurance for EOS end users.

The solution is available today for users of EOS equipment with EOSCONNECT Core and been successfully deployed at EOS end customers worldwide, including several major service providers, R&D labs, and material suppliers.

“We were in search of solutions that could make our development and quality assurance more efficient when we discovered AM Explorer by Interspectral. We now use AM Explorer for quick quality control in our serial production. AM Explorer is our go-to software for understanding non-conformities, and we’re looking forward to see how the product will evolve with more and more automation in future releases.” stated Clément Barret, at MMB Volum-e a leading French service provider.

Interspectral launches integration for EOSCONNECT in AM Explorer, via new module offering EOS customers access to process monitoring data

Developed by Interspectral, AM Explorer is an OEM-agnostic 3D visualization software that empowers users to create multi-channel digital twins from design, simulation, process monitoring, and post-build part analysis data collected throughout the entire additive manufacturing (AM) process.

“When conversing with the market, we recognized that many end users were grappling with laborious manual quality inspection processes. With this new feature, we’re addressing this challenge head-on, breaking down data silos for EOS users. They can now seamlessly access data from their printers and analyze it with powerful interactive 3D visualization, combining it with information from simulations and post-build analyses,” explained Isabelle Hachette, CEO at Interspectral.

Interspectral launches integration for EOSCONNECT in AM Explorer, via new module offering EOS customers access to process monitoring data
Isabelle Hachette, CEO of Interspectral (Fotograf Ristenstrand)

The integration with EOSCONNECT Core within AM Explorer brings value to EOS customers by providing them with easy and direct access to EOS machine data such as PowderBed and OT images. AM Explorer allows to aggregate data from different sources and create a 3D visualization of a part. Data can be seamlessly integrated with simulations and post-build analyses, eliminating data silos and allowing for a holistic view of the additive manufacturing process.

“Our initial studies with service providers indicate that our solution can reduce manual quality inspection costs by more than 50% and significantly mitigate the risk of critical errors,” shared Isabelle Hachette, CEO of Interspectral. “Interspectral, with AM Explorer has a vendor-agnostic, partner-specific approach designed to empower companies in achieving their key initiatives effectively. Our dedicated team specializes in driving this success, aligning with our commitment to fostering growth within the AM industry. While the current AM Explorer version is accessible to all, we offer the Interspectral-AM Explorer advanced edition for collaborative ventures, exemplifying our dedication to productive partnerships.”

Interspectral launches integration for EOSCONNECT in AM Explorer, via new module offering EOS customers access to process monitoring data
AM Explorer, Amexci Karlskoga. Fotograf Ristenstrand

Interspectral is dedicated to being an OEM-agnostic partner, committed to openness and interoperability. This commitment enables them to seamlessly collaborate with leading industry OEMs like EOS, empowering end users to maximize the potential of their additive manufacturing processes without limitations.
“In March 2023, Interspectral became a member of the EOS Developer Network EDN and we have been truly impressed by the remarkable level of integration they have achieved with our APIs and tools. We firmly believe that by offering open APIs and actively supporting developers, we are paving the path for the industrialization of additive manufacturing,” said Mirco Schöpf, Senior Manager of Software at EOS.

The EOS Developer Network enabled Interspectral to build and test the integration in no time. The solution will be presented, including demos from end users such as AMEXCI and Volum-e, at Formnext.

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