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First Lithoz CeraFab Multi 2M30 printer in UK delivered to CSA

Enabling the development of novel, 3D printed, multi-material parts

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Lithoz GmbH, a market and innovation leader in ceramic 3D printing, has delivered and installed the UK’s first CeraFab Multi 2M30 at Compound Semiconductor Applications (CSA) Catapult, a government-backed research facility, headquartered in Newport, South Wales, UK. This impressive machine combines ceramic with ceramic, metal, or polymers in one single layer. It creates composites, enabling entirely new multi-functional applications for research and industry using 3D printing. With its research on this 2M printer, CSA Catapult will contribute to a new dimension of multi-material 3D printing for compound semiconductor packaging and integration.

First Lithoz CeraFab Multi 2M30 printer in UK delivered to CSA. Enabling the development of novel, 3D printed, multi-material parts.
Inside the Lithoz CeraFab Multi 2M30 printer

The CeraFab Multi 2M30 is an LCM-based printer with two separate vats, is capable of combining multiple materials within one single layer, and can vary the material composition layer-by layer. Such material compositions allow for a mixture of differing properties in a single layer and component – thus paving the way to a completely new dimension of application possibilities and enabling a variety of design concepts previously not possible.

The CeraFab Multi, launched in 2020, has already enabled new successes, such as the strongest 3D printed alumina ever produced. With this being the first multi-material 3D printer of its kind in the UK, both Lithoz and CSA Catapult, the recipient of the machine, are looking forward to further innovation once it is operational later in the year.

First Lithoz CeraFab Multi 2M30 printer in UK delivered to CSA. Enabling the development of novel, 3D printed, multi-material parts.
The Lithoz CeraFab Multi 2M30 printer

“The CeraFab Multi 2M30 3D printer, part of the DER Investment in state-of-the-art equipment, is a valuable addition to our advanced semiconductor integration and packaging capability,” stated Dr. Jayakrishnan Chandrappan, Head of Packaging at CSA Catapult, which helps optimize advanced electronic systems and delivers industrial research organization to benefit companies in the UK. “This acquisition will help us develop  novel 3D printed multi-material parts for high-power and high-frequency microelectronics packages, and the multi-material printing facilities will drive energy-efficient, compact and affordable packaging.”

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Edward Wakefield

Edward is a freelance writer and additive manufacturing enthusiast looking to make AM more accessible and understandable.

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