EOS, a global leader in responsible manufacturing solutions for industrial 3D printing, introduced two new metal additive manufacturing (AM) materials: EOS NickelAlloy IN718 API and EOS Nickel NiCP. These high-performance nickel-based powders are designed for Laser Powder Bed Fusion (LPBF) 3D printing technology, expanding the capabilities of AM in industries that demand exceptional mechanical properties and environmental resistance. Specifically, EOS NickelAlloy IN718 API is available for all metal EOS systems with standard EOS IN718 parameter processes. EOS Nickel NiCP is commercially available for EOS M 290 and EOS M 400-4 systems.
Sophia Heyl, EOS product specialist, emphasized the efficiency gains for semiconductor manufacturers, explaining that additive manufacturing these parts can significantly improve machine uptime and throughput, ultimately benefiting wafer fabrication processes and increasing revenue.
“EOS Nickel NiCP has already been successfully deployed in production settings, demonstrating its reliability and performance,” explained Dr. Ankit Saharan, EOS director of metals technology. “By making it more broadly available, we continue to strengthen our engagement with the semiconductor industry and our dedication to advancing their applications through innovative materials and processes. We look forward to working with our partners to push the boundaries of what’s possible with NiCP in additive manufacturing.”
Nickel-based superalloys have long been valued in aerospace, energy, and industrial manufacturing for their ability to withstand extreme temperatures, high mechanical stress, and corrosive environments. Traditionally, some of these alloys have been difficult to process due to their high melting points and work-hardening characteristics. The advent of additive manufacturing has changed that, allowing for complex geometries, material efficiency, and rapid prototyping, all while maintaining the superior performance of nickel alloys. EOS’s new powders will further expand the industrial use of nickel-based AM materials, addressing challenges in fields like oil and gas, semiconductor manufacturing, and chemical processing.
EOS NickelAlloy IN718 API
The first of these materials, EOS NickelAlloy IN718 API, is now available for all EOS metal 3D printing systems that support standard EOS IN718 parameter processes. Engineered specifically to meet API 6ACRA standards, this alloy is tailored for high-performance applications in the oil and gas industry, where extreme conditions demand high strength and corrosion resistance. With a tensile strength of 878 MPa and an elongation of 27% after heat treatment, it delivers the high-impact toughness required for downhole, injection, fixture, and fastener applications. A leading inflow control technology company has already tested the material and is using it to produce a flow module component that meets stringent API standardization and corrosion resistance requirements.
One of the long-standing barriers to adopting additive manufacturing in oil and gas has been meeting industry-specific material standards. A representative from the inflow control company noted that AM had previously been “out of reach” for downhole applications due to the sector’s stringent requirements. With the availability of EOS NickelAlloy IN718 API, that is beginning to change. Companies in oil and gas can now evaluate 3D printing not just for rapid prototyping, but as a full-scale manufacturing solution capable of producing components with the same, if not better, performance characteristics as traditionally machined or cast parts.
EOS Nickel NiCP
EOS is also making strides in semiconductor and chemical applications with EOS Nickel NiCP, now commercially available for EOS M 290 and EOS M 400-4 systems. This high-purity nickel material is designed for corrosion-resistant and ductile applications, particularly where nickel purity and mechanical integrity are critical. With a tensile strength of 400 MPa and an impressive 49% elongation, EOS Nickel NiCP is well-suited for gas injectors, corrosion-resistant components in semiconductor capital equipment, and chemically harsh industrial environments.
Historically, the semiconductor equipment industry has relied on electroless nickel plating to enhance corrosion resistance in parts exposed to aggressive chemicals. However, 3D printing entire components using EOS Nickel NiCP eliminates the need for plating, extending the life of these consumable parts while reducing hazardous waste from electroplating processes. This shift aligns with broader industry efforts to create cleaner, more sustainable manufacturing workflows.
