Electroninks to supply materials for DARPA AMME program

The University of Texas at Austin (UT Austin) has selected Electroninks, a provider of metal complex inks for additive manufacturing and advanced semiconductor packaging, as the exclusive supplier for the core enabling materials technology for its work under the Defense Advanced Research Projects Agency (DARPA) Additive Manufacturing of MicrosystEms (AMME) program. The initiative aims to revolutionize the production of 3D non-planar microsystems by developing new materials and AM technologies. Its goal is to demonstrate a high-throughput process that integrates multiple materials – such as conductors and insulators – within a single structure, enabling complex designs beyond what’s possible with conventional methods.

As part of AMME, UT Austin’s Department of Mechanical Engineering is working alongside several industry leaders and academic institutions to drive breakthrough innovations in advanced semiconductor packaging. Electroninks, a key technology provider in the project, will supply critical materials necessary for AMME’s new 3D interconnection techniques. By developing innovative conductive materials optimized for high-speed, large-area lithographic patterning, Electroninks’ contributions will help overcome fundamental limitations in current semiconductor packaging processes.

AMME seeks to transform microsystem manufacturing by pioneering advancements in high-speed, high-volume, and high-resolution multi-material production. This cutting-edge AM process will enhance commercial devices with next-generation integrated technologies while enabling rapid adaptability to evolving mission requirements – much like how AM has revolutionized complex prototyping. Through AMME, DARPA aims to break through the inherent limitations of traditional microsystem fabrication, unlocking new possibilities for innovation and scalability.

Electoninks’ metal complex inks will be used to significantly increase data transfer rates and dramatically lower the energy consumption of technology platforms. These inks will streamline semiconductor fabrication, boosting yields, improving design flexibility for 3D packages, and cutting packaging time from months to hours. These inks also allow dies to be packaged closer together, meaning electrons travel shorter distances, which increases transfer speeds and reduces the energy consumed. The implications are significant when considering that a single AI data center in 2035 is expected to require several gigawatts, which is the output of an entire nuclear power plant – even a 5% reduction in energy consumption would equal that of building a modern coal power plant.

“AMME represents a significant step forward in semiconductor technology, addressing critical challenges in AI hardware and advanced packaging,” said Professor Michael Cullinan from The University of Texas at Austin. “By integrating cutting-edge materials with state-of-the-art holographic lithography, we aim to drive new levels of efficiency and capability in semiconductor manufacturing.”

DARPA’s investment underscores the strategic importance of advancing next-generation 3D integration technologies to maintain US leadership in semiconductor innovation and defense-related applications. The collaboration between academia, industry, and government-backed research institutions will help accelerate the commercialization of advanced manufacturing techniques critical to the future of high-performance computing and artificial intelligence-driven applications.

“We are obviously poised to be a significant partner for this consortium and play a key role in fulfilling DARPA’s goals,” said Brett Walker, PhD, Co-founder and CEO of Electroninks. “This is great news for the State of Texas, innovation, and the future of technology.”