Medical AMOrthopedic Implants

Curiteva releases 3D printed Inspire Porous PEEK technology

Spinal implants are created using Evonik's VESTAKEEP i4 3DF polymer and an in-house developed 3D printer

Stay up to date with everything that is happening in the wonderful world of AM via our LinkedIn community.

Curiteva, a spinal implant technology company based in Huntsville, AL, USA, has announced a limited commercial release based on its recently FDA-cleared Inspire Porous PEEK HAFUSE Cervical Interbody System. Curiteva pioneered and received clearance of the world’s first 3D printed, fully interconnected porous PEEK structure, utilizing internally developed Fused Filament Fabrication.

The Inspire platform used the Evonik VESTAKEEP i4 3DF PEEK high-performance polymer on a proprietary, patented 3D printer – which is designed, programmed, and built by Curiteva.

Curiteva releases 3D printed Inspire Porous PEEK technology for spinal implants - created using Evonik's VESTAKEEP i4 3DF polymer.
Spinal implant produced using Curiteva’s Inspire Porous PEEK HAFUSE technology.

“I believe structure drives biology and the lattice PEEK architecture enabled by Curiteva’s 3D printing process represents an exciting advancement in spine, orthopedics, and neurosurgical procedures which involve any type of biologic implant,” said Alex Vaccaro, president of Philadelphia-based Rothman Orthopedic Institute.

“The Inspire porous PEEK technology checks all of the boxes for an ideal interbody implant: fully interconnected porosity, modulus of elasticity equivalent to cancellous bone, strong biomechanical properties, radiolucency, and a bioactive surface for osseointegration,” said Kevin Foley, Chairman of Semmes-Murphey Neurologic and Spine Institute and professor of neurosurgery, orthopedic surgery, and biomedical engineering at the University of Tennessee Health Science Center.

“Interconnected porosity, pore size distribution, and nano-surface architecture are typically hallmarks of the most effective synthetic allografts. I believe this novel implant enhanced with HAFUSE nano-surface topography incorporates those features and presents an optimal environment for osteoprogenitor cells to move throughout the implant enhancing bone healing (fusion) and reducing risk of subsidence. I’m excited to offer this to my patients,” said Randy Dryer, from the Central Texas Spine Institute.

“This new technology further demonstrates Curiteva’s commitment to developing and investing in disruptive technologies,” said Todd Reith, Inventor and Vice President of Emerging Technology at Curiteva. “Our unique architecture is the result of years of research and development in 3D printing. As this technology matures, with our internal expertise, we have already contemplated other applications outside of spine and orthopedics.”

The company plans a full commercial launch in the United States later this year.

Research
Composites AM 2024

746 composites AM companies individually surveyed and studied. Core composites AM market generated over $785 million in 2023. Market expected to grow to $7.8 billion by 2033 at 25.8% CAGR. This new...

Edward Wakefield

Edward is a freelance writer and additive manufacturing enthusiast looking to make AM more accessible and understandable.

Related Articles

Leave a Reply

Your email address will not be published. Required fields are marked *

Back to top button
Close Popup
Privacy Settings saved!
Privacy Settings

When you visit any web site, it may store or retrieve information on your browser, mostly in the form of cookies. Control your personal Cookie Services here.

These cookies are necessary for the website to function and cannot be switched off in our systems.

Technical Cookies
In order to use this website we use the following technically required cookies
  • PHPSESSID
  • wordpress_test_cookie
  • wordpress_logged_in_
  • wordpress_sec

Decline all Services
Save
Accept all Services

Newsletter

Join our 12,000+ Professional community and get weekly AM industry insights straight to your inbox. Our editor-curated newsletter equips executives, engineers, and end-users with crucial updates, helping you stay ahead.