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CRP Technology launches super lightweight Windform SL

The black material for PBF/SLS is an ultra-light polyamide-based composite reinforced with carbon fibers that combines exceptional lightweight characteristics with a low density of 0.87 g/cc

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CRP Technology, a pioneering 3D printing company and service bureau, has introduced Windform SL (super lightweight), the twelfth material in the Windform TOP-LINE series. The black material for PBF/SLS is an ultra-light polyamide-based composite reinforced with carbon fibers that combines exceptional lightweight characteristics with a low density of 0.87 g/cc.

The market debut of Windform SL, occurring just a few months after the introduction of Windform TPU, CRP Technology’s second elastomeric material, and the eleventh addition to the TOP-LINE range, reaffirms the company’s commitment to innovation in the realm of 3D printing.

“Our commitment to advancement is resolute. We are a historic, pioneering company continuously innovating, creating top-of-the-line materials for professional 3D printing, and Windform SL is the latest proof, a further step forward in our growth journey that keeps us at the forefront of the industry,” said Franco Cevolini, CEO and Technical Director of CRP Technology. “As a leading 3D printing service provider, I am confident that this material will swiftly become the winning choice for many UAV and automotive customers relying on our 3D printing department for their advanced parts.”

Windform SL is particularly well-suited for producing functional prototypes and components in the UAV/UAS sector, and applications demanding a balance of lightness, stiffness, and thermal resistance.

The heat deflection temperature at 1.82 MPa of 182.5 °C, combined with high values of Specific Tensile Modulus, Specific Tensile Strength, and Impact Strength (Charpy and Izod), are among the key features of Windform SL. These characteristics allow it to maintain structural stability under intense stress, even at elevated temperatures – ensuring reliable performance in demanding environments.

The post-process surface finish is equally noteworthy, with Ra values of 5.44 µm after the SLS process, 1.56 µm after manual finishing, and 0.83 µm after CNC processing.

Windform SL is an advanced solution for the future of professional 3D printing with broad applications in the UAV sector and beyond. The material promises to evolve the production of sophisticated and efficient components across various fields, from aerospace to automotive – ensuring lightweight without reducing thickness.

Research
Composites AM 2024

746 composites AM companies individually surveyed and studied. Core composites AM market generated over $785 million in 2023. Market expected to grow to $7.8 billion by 2033 at 25.8% CAGR. This new...

Edward Wakefield

Edward is a freelance writer and additive manufacturing enthusiast looking to make AM more accessible and understandable.

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