Case StudiesElectronicsIndustrial Additive ManufacturingMetal Additive Manufacturing

EOS and TheSys team up to 3D print the future of gaming CPU’s thermal management

A 3D printed CPU cooling system could take up up to 81% less space

Stay up to date with everything that is happening in the wonderful world of AM via our LinkedIn community.

One of the most relevant, effective and important applications of industrial 3D printing is high-performance heat exchangers to manage extreme heat in the aerospace and energy segments. So why not use these capabilities to improve thermal management in high-performance gaming CPU’s? On the occasion of the E3 2019 show in Los Angeles – the most important show for the global videogame industry – EOS, its venture AM Metals and thermal management experts TheSys used developed a 3D printed CPU cooling system and demonstrate what the future of processor thermal management could look like.

Excess heat limits the miniaturization of portable computers, power electronic devices and high-power LED lighting. Ambitious technological solutions from the lab are often not yet ready for mass production and deployment in consumer products. Industrial 3D printing of thermal management solutions can bridge the gap and keep electronics cool even when the available space is severely limited, just like they do in thermal management applications on rocket engines and in gas turbines.

Additive manufacturing technology enables thermal management components to offer the same or superior effectiveness as conventionally manufactured components while requiring far less space and even with the possibility of custom-shaping a part in order to best fit in the space around it (and not the other way around). Enlarged surfaces, any-shape geometries and conformal cooling channels are key opportunities offered by 3D printing’s ability to produce a part of any shape – exactly as you see it in the CAD computer model. And what goes around, comes around.

3D printed CPU cooling system

A 3D printed CPU cooling system in 81% less space

Excess heat limits the miniaturization of high-performance computers, such as those used for gaming or high-level computer graphic design

Equipped with state-of-the-art additive manufacturing and material technology, AM Metals’ application development specialists created an innovative design that can match the best-in-class gaming CPU coolers. Thermal solutions specialist TheSys carried out thermal simulations that served as the basis for an improved version of the cooler. With only one iteration, the companies came up with a design that meets the target cooling performance. The design was realized on an EOS M290 machine in a matter of hours. By comparison, producing an entirely new component from scratch by traditional methods would require months.

The result is a CPU cooler which operates at the same cooling performance but requires 81% less space than the original design. This is clearly an enormous improvement in an extremely reduced development time (and costs). Besides CPU coolers there are countless electronic applications where space for heat transfer is a premium. For example high power LEDs, lasers, autonomous driving, power electronics, and chemical microreactors. ”

We believe that additive manufacturing can bridge the gap between current market demands for miniaturized thermal management solutions and future technologies that might circumvent the problem in a fundamental way,” Matthias Hoeh, Business Development Manager at EOS, wrote on this LinkedIn Pulse post. Hoeh is now working on a detailed white paper about this gaming CPU cooler project. to obtain it you can contact Mr. Hoeh via his LinkedIn by following the link above.

Composites AM 2024

746 composites AM companies individually surveyed and studied. Core composites AM market generated over $785 million in 2023. Market expected to grow to $7.8 billion by 2033 at 25.8% CAGR. This new...

Davide Sher

Since 2002, Davide has built up extensive experience as a technology journalist, market analyst and consultant for the additive manufacturing industry. Born in Milan, Italy, he spent 12 years in the United States, where he completed his studies at SUNY USB. As a journalist covering the tech and videogame industry for over 10 years, he began covering the AM industry in 2013, first as an international journalist and subsequently as a market analyst, focusing on the additive manufacturing industry and relative vertical markets. In 2016 he co-founded London-based VoxelMatters. Today the company publishes the leading news and insights websites and, as well as VoxelMatters Directory, the largest global directory of companies in the additive manufacturing industry.

Related Articles

Leave a Reply

Your email address will not be published. Required fields are marked *

Back to top button
Close Popup
Privacy Settings saved!
Privacy Settings

When you visit any web site, it may store or retrieve information on your browser, mostly in the form of cookies. Control your personal Cookie Services here.

These cookies are necessary for the website to function and cannot be switched off in our systems.

Technical Cookies
In order to use this website we use the following technically required cookies
  • wordpress_test_cookie
  • wordpress_logged_in_
  • wordpress_sec

Decline all Services
Accept all Services


Join our 12,000+ Professional community and get weekly AM industry insights straight to your inbox. Our editor-curated newsletter equips executives, engineers, and end-users with crucial updates, helping you stay ahead.